Polarography of Te (IV) Anions in Neutral Solutions in Presence of 2,2'- Dipyridyl and Fe(dipy)3 2+ - Complexes
DOI:
https://doi.org/10.18321/ectj411Abstract
The electroreduction of Te (IV) ions in neutral non-buffer solutions containing 2,2'-dipyridyl (4⋅10-5-4⋅10-3 M) or tris-dipyridyl iron (II) complexes is studied by the polarographic method. NaF (0.01-0.5 M) orNaNO3 (0.1-1 M) are used as supporting electrolytes. The mechanism of electrochemical reactions of Te (IV) anions on mercury electrodes in the presence of the additives is discussed. The electroreduction of Te (IV) anions is shown to proceed through electron transfer and proton addition. The obtained results point to a considerable influence of electric double layer structure on electrochemical reactions of Te (IV) ions in the presence of inorganic and specifically adsorbed organic compounds in
the electrolyte. It is shown, that 2,2'-dipyridyl does not form complexes with Te (IV) anions. Having been adsorbed on the surface of mercury electrode, 2,2'-dipyridyl complexes increase negative Ψ'-potential that results in a shift of Te (IV) electroreduction wave to more negative potentials and decrease in the current of Te (IV) wave and peak at -1.19 V. It is shown that 2,2'-dipyridyl molecules at ε > 0, (ε – charge of an electrode) are adsorbed in plane orientation, and at ε < 0, plane or vertical. Vertically adsorbed molecules cause a significant decrease in the double layer capacitance. At negative potentials orientation of 2,2'-dipyridyl molecules changes from plane to vertical with the increasing 2,2'-dipyridyl concentration. This change of orientation results in a typical maximum capacitance emerging in the potential range of -0.7 to -1.2 V. It is shown that the supporting electrolyte, 2,2'-dipyridyl and Fe(dipy)32+ have influence on the electroreduction of Te (IV) anions in neutral non-buffer solutions through a change in the Ψ'-potential of mercury electrode.
References
(1). Ghdanov S.I., Encyclopedia of Electrochemistry of Elements (Ed. A.J. Bard), N.Y., 1973, p.156.
(2). Lingane J.J., Niedrach L.W., J. Amer. Chem. Soc. 71:196 (1949).
(3). Dergacheva M., Statsyuk V., Fogel L, Eurasian Chemico-Technological Journal. 3-4:283 (2000).
(4). Shmidt H., von Stackelberg M., J. Polarogr. Soc. 8:49 (1962).
(5). Lingane J.J., Niedrach L.W., J. Amer. Chem. Soc. 70:4115 (1948).
(6). Volaire M., Vittori O., Porthault M., Analytica Chimica Acta, 71:185 (1974).
(7). Dergacheva M., Statsyuk V., Fogel L., Pen'kova N., 4-th International Symposium ''New Materials for Electrochemical Systems''. Montreal, Canada. July 9-13, 2001, p. 130.
(8). Pourbaix M. Atlas d'equilibres electrochimiques, Paris, 1963, p. 560.
(9). Perrin D. Stability constants of metal-ion complexes. Part B: Organic ligands. IUPAC, 1979, p. 22.
(10). Mambetkasiev E.A., Ghdanov S.I., Damaskin B.B., Russ. J. Electrochem. 8:1650 (1972).
(11). Ahmetov N.K., Kaganovich R.I., Damaskin B.B., Vestnik MSU, ser. 2, Chemistry. 20:422 (1979).
(12). Mironov V.E., Isaev I.D., Stability Constants for metal complexes in solutions, Krasnoyarsk, Rus., 1983, p. 88.
(13). Stranks D.R., Wilkins R.Y., Chem. Rev. 57:743 (1957).
(14). Statsyuk V.N., Kravtsov V.I., Russ. J. Electrochem. 35:104 (1999).
(15). Neves E.A., Anson F.G., J. Electroanalyt. Chem., 71:181 (1976).
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