Optimization of Electroless Copper Plating on Polyethylene Films Modified by Surface Grafting of Vinyl Ether of Monoethanolamine

Authors

  • A. Abdel Aal Central Metallurgical Research & Development Institute (CMRDI), Surface Protection &Corrosion Control Lab, P.O. 87 Hellwan, Cairo, Egypt
  • V.V. Khutoryanskiy Reading School of Pharmacy, University of Reading, Whiteknights, PO Box 224, RG6 6AD Reading, United Kingdom
  • Z.S. Nurkeeva Kazakh National University, Department of Chemical Physics & Macromolecular Chemistry, Karasai Batyra 95, 050012 Almaty, Kazakhstan
  • G.A. Mun Kazakh National University, Department of Chemical Physics & Macromolecular Chemistry, Karasai Batyra 95, 050012 Almaty, Kazakhstan

DOI:

https://doi.org/10.18321/ectj256

Abstract

Metallized plastics have recently received significant interest for their useful applications in electronic devices such as for integrated circuits, packaging, printed circuits and sensor applications. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. There are several techniques for metal deposition on surface of polymers such as evaporation, sputtering, electroless plating and electrolysis. In this work the metallized films were developed by electroless copper plating of polyethylene films grafted with vinyl ether of monoethanoleamine. Polyethylene films were subjected to gamma-radiation induced surface graft copolymerization with vinyl ether of monoethanolamine. Electroless copper plating was carried out effectively on the modified films. The catalytic processes for the electroless copper plating in the presence and the absence of SnCl2 sensitization were studied and the optimum activation conditions that give the highest plating rate were determined. The effect of grafting degree on the plating rate is studied. Electroless plating conditions (bath additives, pH and temperature) were optimized. Plating rate was determined gravimetrically and spectrophotometrically at different grafting degrees. The results reveal that plating rate is a function of degree of grafting and increases with increasing grafted vinyl ether of monoethanolamine onto polyethylene. It was found that pH 13 of electroless bath and plating temperature 40 °C are the optimal conditions for the plating process. The increasing of grafting degree results in faster plating rate at the same pH and temperature. The surface morphology of the metallized films was investigated using scanning electron microscopy (SEM). The adhesion strength between the metallized layer and grafted polymer was studied using tensile machine. SEM photos and adhesion measurements clarified that uniform and adhered deposits were obtained under optimum conditions.

References

(1). K.L. Mittal (ed.) Metallized Plastics. Fundamentals and applications. Marcel Dekker, Inc.: New York, 1998, 1-373.

(2). H. Niino, A. Yabe, Appl. Surf. Sci, 1996, 96-98, 550-557.

(3). J. Kurdi, H. Ardelean, P. Markus, P. Jonnard, F. Arefi-Khonsari, Appl. Surf. Sci., 2002, 189, 119-128.

(4). S. Wu, E.T. Kang, K.C. Neoh, K.L. Tan, Langmuir, 2000, 16, 5192-5198.

(5). G.H. Yang, E.T. Kang, K.G. Neoh, Y. Zhang, K.L. Tan, Langmuir, 2001, 17, 211-218.

(6). W.C. Wang, E.T. Kang, K.G. Neoh, Appl. Surf. Sci., 2002, 199, 52-66.

(7). Z.J. Yu, E.T. Kang, K.G. Neoh, Polymer, 2002, 43, 4137-4146.

(8). G.H. Yang, C. Lim, Y.P. Tan, Y. Zhang, E.T. Kang, K.G. Neoh, Eur. Polym. J., 2002, 38, 2153-2160.

(9). M. Charbonnier, M. Alami, M. Romand, J.P. Girardeau-Montaut, M. Afif, Appl. Surf. Sci., 1997, 109-110, 206-211.

(10). S. Kudaikulova, O. Prikhodko, G. Boiko, B. Zhubanov, V. Yu. Voytekunas, M.J.M. Abadie, in Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, K.L. Mittal, ed., 2003, VSP, Vol. 2.

(11). N.A. Mohamed, Eur. Polym. J., 1998, 34, 387-398.

(12). V.Ya. Kabanov, Vysokomolek. Soed. B., 1995, 37, 1107-1120.

(13). K. Kato, E.Uchida, E.T. Kang., Y. Uyama, Y. Ikada, Prog. Polym. Sci., 2003. 28, 209-259.

(14). Z.S. Nurkeeva, A.A. Aal, V.V. Khutoryanskiy, G.A. Mun, S.M. Koblanov, Radiat. Phys. Chem., 2002, 65, 249-254.

(15). A.A. Aal, V.V. Khutoryanskiy, Z.S. Nurkeeva, G.A. Mun, J. Mater. Chem., 2002, 12, 2692-2695.

(16). Y. Shacham-Diamand, V. Dubin, M. Angyal, Thin Solid Films, 1995, 262, 93-103.

(17). Y. Shacham-Diamand, V. Dubin, Microelectronic Eng., 1997, 33, 47-58.

(18). M. Paunovic, R. Arndt. J. Electrochem. Soc. 1983, 130, 794-799.

(19). G.H. Yang, C. Lim, Y.P.Tan, Y. Zhang, E.T.Kang, K.G.Neoh, Eur. Polym. J., 2002, 38, 2153-2160.

(20). F.J. Nuzzi, Plating and Surface Finishing, 1983, 70, 51-54.

(21). F. Hanna, Z.A. Hamid, A. Abdel Aal, Materials Letters, 2003, 58, 104-109.

Downloads

Published

2007-01-10

How to Cite

Aal, A. A., Khutoryanskiy, V., Nurkeeva, Z., & Mun, G. (2007). Optimization of Electroless Copper Plating on Polyethylene Films Modified by Surface Grafting of Vinyl Ether of Monoethanolamine. Eurasian Chemico-Technological Journal, 9(1), 63–69. https://doi.org/10.18321/ectj256

Issue

Section

Articles